Fujitsu Scores Industry First with Its Latest RF Transceiver Silicon for MIDs

Event Summary

June 2, 2010 -- Fujitsu Microelectronics America (FMA) announced the first transceiver that supports 3GPP LTE/WCDMA/EGPRS in a single silicon chip: the MB86L 10A. It eliminates the need for 3G and LTE TX and RX interstage SAW filters and low-noise amplifiers (LNAs). The single chip features backwards compatibility with a high-level API for radio control using DigRF/MIPI D3G and D4G open standard digital interfaces. The compact module is designed to allow cell phone manufacturers to reduce component count, board space, and total bill of materials. The transceiver supports quad-band GSM/EDGE and up to five WCDMA or LTE bands.

Quick Take

Analytical Summary

• Current Perspective: Very positive on FMA’s announcement of its new multimode, multiband LTE/UMTS/GPRS/EDGE solution on a single chip, because it represents the highest-density support currently available in terms of both the number and diversity of devices supported. It will clearly reduce parts count and save valuable board space within the designs in which it is used.

• Vendor Importance: High to FMA, because it needed to establish its position with respect to emerging LTE opportunities and counter the more recent releases from rivals such as TI (please see Mobile World Congress 2010: Texas Instruments Takes Connectivity Integration to Another Level, February 11 , 2010) as well as established products from Beceem and others that specialize in the LTE RF transceiver portion of the mobile device silicon market.

• Market Impact: High on the RF transceivers segment of the mobile device silicon market, because this release from Fujitsu just raised the bar on the number of RF transceiver technology types that the designers can expect to have in a single chip. Its dual-mode interface support of both 3G and 4G DigRF to the baseband IC is also an added advantage, making it compatible with a broader range of baseband modem technologies.

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