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TI Expands Its OMAP 35x EVM Proposition with WiLink 6.0 Sweetener| Apr 7, 2010 | Mobile Device Silicon | Analysts: Ron Westfall, Jeff Ogle Event SummaryApril 5, 2010 – Giving designers working on the OMAP35x platform the opportunity to incorporate wireless connectivity technology into their portable designs, Texas Instruments (TI) introduced the availability of its WiLink 6.0 (WL1271) solution on the OMAP35x processor Evaluation Module (EVM). With this solution, TI is making wireless connectivity solutions available for design in a broad array of applications. One of the smallest solutions to integrate wireless LAN (WLAN) and Bluetooth technologies in a single chip, the WL1271 solution sparks futuristic designs on the EVM through the combination of TI’s OMAP processor and wireless connectivity. Quick Take
Analytical Summary• Current Perspective: Moderate on TI’s announcement that it has integrated its WiLink 6.0 solution into the OMAP 35x evaluation board because it represented a logical yet obvious next step for the company. The pressing question that now remains is the time frame for the WiLink 7.0 solution to be available on an evaluation board as well. CLIENTS ONLY Competitive Positives and ConcernsResponse & RecommendationsBuyer ActionsAnalytical Perspective| Client access - Full report in Mobile Device Silicon | More information |
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