Current Analysis
Markets We Cover Solutions & Tools Who Can Benefit What is Competitive Response Custom Solutions
Competitive Intelligence Highlights
Mobile Device Silicon
ANALYSIS
Overview
Intelligence Report Summaries
Companies
Products
Complimentary Competitive Intelligence
   





For more information immediately on how Current Analysis can help your company, please contact:
NORTH AMERICA
Donna Simek

Vice President, Sales
+1 508 785 2262
INTERNATIONAL
Ted Howard-Jones
Vice President Sales
+44 1491 639 311




TI Expands Its OMAP 35x EVM Proposition with WiLink 6.0 Sweetener


| Apr 7, 2010 | Mobile Device Silicon
| Analysts: Ron Westfall, Jeff Ogle

Event Summary

April 5, 2010 – Giving designers working on the OMAP35x platform the opportunity to incorporate wireless connectivity technology into their portable designs, Texas Instruments (TI) introduced the availability of its WiLink 6.0 (WL1271) solution on the OMAP35x processor Evaluation Module (EVM). With this solution, TI is making wireless connectivity solutions available for design in a broad array of applications. One of the smallest solutions to integrate wireless LAN (WLAN) and Bluetooth technologies in a single chip, the WL1271 solution sparks futuristic designs on the EVM through the combination of TI’s OMAP processor and wireless connectivity.

Quick Take

Analytical Summary

• Current Perspective: Moderate on TI’s announcement that it has integrated its WiLink 6.0 solution into the OMAP 35x evaluation board because it represented a logical yet obvious next step for the company. The pressing question that now remains is the time frame for the WiLink 7.0 solution to be available on an evaluation board as well.

• Vendor Importance: Moderate to TI, because all vendors of mobile silicon devices offer development boards and tools to aid their customer in the design and implementation of the end product. The action will help TI to focus its products and customers on the combined capabilities of its wireless connectivity technology and its application processor technology within a mobile silicon platform context.

• Market Impact: Low on the overall mobile device silicon market as this move alone will not likely drive a shift or change in mind share among potential mobile device OEMs. A dual technology wireless device is also nothing special in this market segment as many mobile silicon vendors already offer such capabilities and options. What will have more market significance is when the quad-wireless connectivity WiLink 7.0 solution (i.e., WiFi a/b/g/n, FM, Bluetooth and GPS on a single chip) becomes available on an EVB with an OMAP35x processor.


CLIENTS ONLY

Competitive Positives and Concerns

Response & Recommendations

Buyer Actions

Analytical Perspective

| Client access - Full report in Mobile Device Silicon | More information

Top


Current Analysis Offices
Washington, D.C. +1 703 404 9200, Toll free 877 787 8947
Paris, France +33 (0) 1 41 14 83 15
© 2012 Current Analysis Inc. All rights reserved. | Privacy Policy
Follow Current Analysis